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Title: A Novel Segmented Modeling Method of Via including the Effect of Power/Ground Plane Pair
Author: ZhaowenYan,ZhicaiMa,GuochangShi,and MingmingChe
purpose: The main purpose of the passage is to present and validate a novel segmented modeling method for vias in printed circuit boards (PCBs) that includes the effects of power and ground plane pairs. This method aims to enhance the accuracy and efficiency of modeling high-frequency interconnect structures, which is crucial for maintaining signal integrity, power integrity, and electromagnetic compatibility in modern high-speed electronic systems. The passage describes the methodology, highlights the advantages over existing methods, and demonstrates the effectiveness of the proposed approach through comparison with full-wave simulation results.
Resonance Characteristics of Plane Pair:
Cavity Resonance Method:
Impedance Calculation:
Modeling Techniques:
Overview of Segmented Modeling:
Segmentation of the Via Structure:
Modeling Each Segment:
Incorporation of Impedance Effects:
LC Second-Order Circuit Model:
Overview of Examples:
Example 1: Single Via in a Simple PCB Structure:
Example 2: Differential Vias in a Complex PCB Structure:
Comparison with Full-Wave Simulations:
Importance of Modeling Coupled Channels:
Segmentation Approach for Coupled Channels:
LC Circuit Model for Coupled Segments:
Integration of Power/Ground Plane Effects:
Summary of the Research:
Proposed Segmented Modeling Method:
Validation and Results:
Advantages of the Segmented Modeling Method:
Applications and Implications:
Future Work:
(先写这么多,有些东西自己也还不是特别理解,后面会再优化和补充)
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