【EI会议征稿】第三届电子信息工程与数据处理国际学术会议（EIEDP 2024）_2024 3rd international conference on electronic in

第三届电子信息工程与数据处理国际学术会议（EIEDP 2024）

2024 3rd International Conference on Electronic Information Engineering and Data Processing

Welcome to the official website of 2024 3rd International Conference on Electronic Information Engineering and Data Processing(EIEDP 2024).

2024 3rd International Conference on Electronic Information Engineering and Data Processing(EIEDP 2024) will be held on March 15-17, 2024 in Kuala Lumpur, Malaysia. EIEDP 2024 is to bring together innovative academics and industrial experts in the field of Electronic Information Engineering and Data Processing to a common forum. The primary goal of the conference is to promote research and developmental activities in  Electronic Information Engineering and Data Processing and another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working all around the world. The conference will be held every year to make it an ideal platform for people to share views and experiences in electronic information engineering and data processing and related areas. We warmly invite you to participate in EIEDP 2024.

重要信息

会议官网：www.eiedp.net（点击参会/投稿/了解会议详情）

大会时间：2024年3月15-17日

大会地点：马来西亚 · 吉隆坡

录用通知：投稿后1周左右

会议检索：EI核心、SCOPUS

 

 

征稿主题

* 其他相关主题均可

EI会议论文集征稿

EIEDP 2024所有的投稿都必须经过2-3位组委会专家审稿，经过严格的审稿之后，EIEDP 2024会议所录用论文将以论文集的形式出版，出版后提交 EI Compendex, Scopus检索。

注：

1、会议仅接受全英稿件。

2、论文应具有学术或实用价值，未在国内外学术期刊或会议发表过。发表论文的作者需提交全文进行同行评审，只做报告不发表论文的作者只需提交摘要。

3、作者可通过CrossCheck, Turnitin或其他查询体统自费查重，否则由文章重复率引起的被拒搞将由作者自行承担责任。涉嫌抄袭的论文将不被出版，且公布在会议主页。

4、论文需按照会议官网的模板排版，EI会议稿件排版后不得少于4页；SCI期刊稿件排版后不得少于8页。仅接受全英投稿。

参会须知

1、作者参会：一篇录用文章允许一名作者免费参会； 

2、主旨报告：可申请主题演讲，由组委会审核； 

3、口头报告：可申请口头报告，时间为15分钟； 

4、海报展示：可申请海报展示，A1尺寸，彩色打印； 

5、听众参会：不投稿仅参会，也可申请演讲及展示；